CMP Slurries (for Cu, STI, W)
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Resumen
CMP Slurries (for Cu, STI, W) for semiconductor planarization.
Número CAS
N/A
Fórmula Molecular
N/A
Product Grade
SEMI
Apariencia
paste-gel
Formas de entrega
Drum IBC
Descripción del Producto
CMP Slurries (for Cu, STI, W) are specialized chemical solutions designed for the chemical mechanical planarization process in semiconductor manufacturing. These slurries are crucial for achieving a smooth, flat surface on wafers, which is essential for high-performance integrated circuits. They are widely used in the electronics and semiconductor industry, offering excellent polishing efficiency and selectivity.
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