CMP Slurries (for Cu, STI, W)
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Overview
CMP Slurries (for Cu, STI, W) for semiconductor planarization.
CAS Number
N/A
Molecular Formula
N/A
Product Grade
SEMI
Appearance
paste-gel
Delivery Forms
Drum IBC
Product Description
CMP Slurries (for Cu, STI, W) are specialized chemical solutions designed for the chemical mechanical planarization process in semiconductor manufacturing. These slurries are crucial for achieving a smooth, flat surface on wafers, which is essential for high-performance integrated circuits. They are widely used in the electronics and semiconductor industry, offering excellent polishing efficiency and selectivity.
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