CMP Slurries (for Cu, STI, W)
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价格标语
Overview
CMP Slurries (for Cu, STI, W) for semiconductor planarization.
CAS号
N/A
分子式
N/A
产品等级
SEMI
Appearance
paste-gel
包装形式
Drum IBC
产品描述
CMP Slurries (for Cu, STI, W) are specialized chemical solutions designed for the chemical mechanical planarization process in semiconductor manufacturing. These slurries are crucial for achieving a smooth, flat surface on wafers, which is essential for high-performance integrated circuits. They are widely used in the electronics and semiconductor industry, offering excellent polishing efficiency and selectivity.
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