CMP Slurries (for Cu, STI, W)
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Aperçu
CMP Slurries (for Cu, STI, W) for semiconductor planarization.
Numéro CAS
N/A
Formule Moléculaire
N/A
Product Grade
SEMI
Apparence
paste-gel
Formes de livraison
Drum IBC
Description du Produit
CMP Slurries (for Cu, STI, W) are specialized chemical solutions designed for the chemical mechanical planarization process in semiconductor manufacturing. These slurries are crucial for achieving a smooth, flat surface on wafers, which is essential for high-performance integrated circuits. They are widely used in the electronics and semiconductor industry, offering excellent polishing efficiency and selectivity.
Produits Connexes
More products from Planarization in Electronic & Semiconductor Chemicals