Epoxy Encapsulants

Epoxy Encapsulants - CAS N/A - Chemical Product
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价格标语

Overview

Epoxy Encapsulants for reliable IC protection and adhesion.

CAS号

N/A

分子式

N/A

产品等级

SEMI

Appearance

paste-gel

包装形式

Pail Drum IBC

产品描述

Epoxy Encapsulants are high-performance materials designed to provide excellent protection and insulation in electronic and semiconductor applications. They serve as crucial components in the encapsulation of integrated circuits (ICs), offering superior adhesion, thermal stability, and resistance to environmental factors. These encapsulants are widely used in the electronics industry for their ability to enhance the durability and reliability of sensitive electronic components.