Epoxy Encapsulants

Epoxy Encapsulants - CAS N/A - Chemical Product
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Resumen

Epoxy Encapsulants for reliable IC protection and adhesion.

Número CAS

N/A

Fórmula Molecular

N/A

Product Grade

SEMI

Apariencia

paste-gel

Formas de entrega

Pail Drum IBC

Descripción del Producto

Epoxy Encapsulants are high-performance materials designed to provide excellent protection and insulation in electronic and semiconductor applications. They serve as crucial components in the encapsulation of integrated circuits (ICs), offering superior adhesion, thermal stability, and resistance to environmental factors. These encapsulants are widely used in the electronics industry for their ability to enhance the durability and reliability of sensitive electronic components.