Epoxy Encapsulants
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Overview
Epoxy Encapsulants for reliable IC protection and adhesion.
CAS Number
N/A
Molecular Formula
N/A
Product Grade
SEMI
Appearance
paste-gel
Delivery Forms
Pail Drum IBC
Product Description
Epoxy Encapsulants are high-performance materials designed to provide excellent protection and insulation in electronic and semiconductor applications. They serve as crucial components in the encapsulation of integrated circuits (ICs), offering superior adhesion, thermal stability, and resistance to environmental factors. These encapsulants are widely used in the electronics industry for their ability to enhance the durability and reliability of sensitive electronic components.
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