Heat Sink Compounds
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价格标语
Overview
Heat Sink Compounds for efficient thermal management in electronics.
CAS号
N/A
分子式
N/A
产品等级
SEMI
Appearance
paste-gel
包装形式
Canister Pail
产品描述
Heat Sink Compounds are designed to enhance the thermal conductivity between heat-generating components and their heat sinks. These compounds are widely used in the Electronics & Semiconductors industry, particularly in modules, to ensure optimal performance and longevity of electronic devices by effectively dissipating heat. They offer excellent thermal stability and reliability, making them a crucial component in thermal management solutions.