Heat Sink Compounds
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Overview
Heat Sink Compounds for efficient thermal management in electronics.
CAS Number
N/A
Molecular Formula
N/A
Product Grade
SEMI
Appearance
paste-gel
Delivery Forms
Canister Pail
Product Description
Heat Sink Compounds are designed to enhance the thermal conductivity between heat-generating components and their heat sinks. These compounds are widely used in the Electronics & Semiconductors industry, particularly in modules, to ensure optimal performance and longevity of electronic devices by effectively dissipating heat. They offer excellent thermal stability and reliability, making them a crucial component in thermal management solutions.
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