Acid Copper Plating Solution

Acid Copper Plating Solution - CAS N/A - Chemical Product
Produit Dangereux
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Aperçu

Acid Copper Plating Solution for high-quality electronic plating.

Numéro CAS

N/A

Formule Moléculaire

N/A

Product Grade

SEMI

Danger Class

CLASS 8

Corrosive Substances

Apparence

liquid

Formes de livraison

Drum IBC Bulk

Description du Produit

Acid Copper Plating Solution is a specialized liquid used in the electronics and semiconductor industry. It is designed to provide a uniform and adherent copper layer on substrates, making it ideal for through-hole plating applications. This solution ensures excellent conductivity and corrosion resistance, while also promoting strong adhesion between the copper deposit and the substrate.