Acid Copper Plating Solution
Produit Dangereux
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Aperçu
Acid Copper Plating Solution for high-quality electronic plating.
Numéro CAS
N/A
Formule Moléculaire
N/A
Product Grade
SEMI
Danger Class
CLASS 8
Corrosive Substances
Apparence
liquid
Formes de livraison
Drum IBC Bulk
Description du Produit
Acid Copper Plating Solution is a specialized liquid used in the electronics and semiconductor industry. It is designed to provide a uniform and adherent copper layer on substrates, making it ideal for through-hole plating applications. This solution ensures excellent conductivity and corrosion resistance, while also promoting strong adhesion between the copper deposit and the substrate.
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