Buffered Oxide Etch (BOE, HF/NH₄F)
Produit Dangereux
Contact for Price
Price on request
Aperçu
Buffered Oxide Etch (BOE, HF/NH₄F) for precise oxide layer removal.
Numéro CAS
N/A
Formule Moléculaire
HF/NH₄F
Product Grade
SEMI
Danger Class
CLASS 8
Corrosive Substances
Apparence
liquid
Formes de livraison
Drum IBC Bulk Pail
Description du Produit
Buffered Oxide Etch (BOE, HF/NH₄F) is a selective etching solution used primarily in the semiconductor industry. It is designed to remove silicon dioxide layers without damaging the underlying silicon substrate, making it ideal for fine patterning and cleaning applications. This product is crucial in electronics manufacturing, offering high selectivity and uniform etching rates, which are essential for maintaining the integrity of microelectronic devices.
Produits Connexes
More products from Wet Etchants in Electronic & Semiconductor Chemicals