Buffered Oxide Etch (BOE, HF/NH₄F)

Buffered Oxide Etch (BOE, HF/NH₄F) - CAS N/A - Chemical Product
Producto Peligroso
Contact for Price

Price on request

Resumen

Buffered Oxide Etch (BOE, HF/NH₄F) for precise oxide layer removal.

Número CAS

N/A

Fórmula Molecular

HF/NH₄F

Product Grade

SEMI

Danger Class

CLASS 8

Corrosive Substances

Apariencia

liquid

Formas de entrega

Drum IBC Bulk Pail

Descripción del Producto

Buffered Oxide Etch (BOE, HF/NH₄F) is a selective etching solution used primarily in the semiconductor industry. It is designed to remove silicon dioxide layers without damaging the underlying silicon substrate, making it ideal for fine patterning and cleaning applications. This product is crucial in electronics manufacturing, offering high selectivity and uniform etching rates, which are essential for maintaining the integrity of microelectronic devices.