Buffered Oxide Etch (BOE, HF/NH₄F)
Gefährliches Produkt
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Overview
Buffered Oxide Etch (BOE, HF/NH₄F) for precise oxide layer removal.
CAS-Nummer
N/A
Molekularformel
HF/NH₄F
Product Grade
SEMI
Danger Class
CLASS 8
Corrosive Substances
Appearance
liquid
Lieferformen
Drum IBC Bulk Pail
Product Description
Buffered Oxide Etch (BOE, HF/NH₄F) is a selective etching solution used primarily in the semiconductor industry. It is designed to remove silicon dioxide layers without damaging the underlying silicon substrate, making it ideal for fine patterning and cleaning applications. This product is crucial in electronics manufacturing, offering high selectivity and uniform etching rates, which are essential for maintaining the integrity of microelectronic devices.
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