Wafer Backgrinding Tapes
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شعار السعر
Overview
Wafer Backgrinding Tapes for semiconductor processing.
رقم CAS
N/A
الصيغة الجزيئية
N/A
درجة المنتج
SEMI
Appearance
solid
وصف المنتج
Wafer Backgrinding Tapes are specialized tapes designed to support and protect wafers during the backgrinding process. These tapes are crucial in the semiconductor industry, ensuring that wafers remain intact and undamaged as they are thinned down. They offer excellent adhesion, high-temperature resistance, and clean removability, making them an essential component in IC manufacturing.
المنتجات ذات الصلة
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