Wafer Backgrinding Tapes

Wafer Backgrinding Tapes - CAS N/A - Chemical Product
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Overview

Wafer Backgrinding Tapes for semiconductor processing.

CAS Number

N/A

Molecular Formula

N/A

Product Grade

SEMI

Appearance

solid

Product Description

Wafer Backgrinding Tapes are specialized tapes designed to support and protect wafers during the backgrinding process. These tapes are crucial in the semiconductor industry, ensuring that wafers remain intact and undamaged as they are thinned down. They offer excellent adhesion, high-temperature resistance, and clean removability, making them an essential component in IC manufacturing.