底部填充封装材料

Underfill Encapsulants are specialized materials designed to protect and enhance the reliability of semiconductor devices, particularly in flip-chip applications. These encapsulants serve as adhesion promoters, ensuring a strong bond between the chip and substrate, while also acting as curing agents and thermal conductivity enhancers. They are widely used in the electronics and semiconductors industry, where their dielectric properties and ability to withstand thermal cycling make them essential for high-performance and long-lasting electronic components.