Molding Compounds
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价格标语
Overview
Molding Compounds for reliable IC packaging solutions.
CAS号
N/A
分子式
N/A
产品等级
SEMI
Appearance
solid
包装形式
Bag Drum
产品描述
Molding Compounds are specialized materials designed to encapsulate and protect integrated circuits (ICs) during the semiconductor manufacturing process. These compounds offer excellent thermal stability, ensuring that electronic components remain protected under high-temperature conditions. Key applications include IC packaging, where they provide mechanical support and environmental protection. Molding Compounds are widely used in the electronics and semiconductor industry, contributing to the durability and performance of electronic devices.