Molding Compounds
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Aperçu
Molding Compounds for reliable IC packaging solutions.
Numéro CAS
N/A
Formule Moléculaire
N/A
Product Grade
SEMI
Apparence
solid
Formes de livraison
Bag Drum
Description du Produit
Molding Compounds are specialized materials designed to encapsulate and protect integrated circuits (ICs) during the semiconductor manufacturing process. These compounds offer excellent thermal stability, ensuring that electronic components remain protected under high-temperature conditions. Key applications include IC packaging, where they provide mechanical support and environmental protection. Molding Compounds are widely used in the electronics and semiconductor industry, contributing to the durability and performance of electronic devices.
Produits Connexes
More products from Packaging in Electronic & Semiconductor Chemicals