OSP (Organic Solderability Preservative)
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Overview
OSP for PCBs enhances solderability and protects copper surfaces.
CAS Number
N/A
Molecular Formula
N/A
Product Grade
SEMI
Appearance
liquid
Delivery Forms
Drum Canister Pail
Product Description
OSP (Organic Solderability Preservative) is a chemical treatment used to protect the copper surface of printed circuit boards (PCBs). It significantly improves the solderability of the board by forming a protective layer that prevents oxidation. This product is widely utilized in the electronics and semiconductor industries, where it plays a crucial role in ensuring reliable solder joints and extending the shelf life of PCBs. Notable properties include excellent adhesion, corrosion resistance, and compatibility with various assembly processes.
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