Electroless Copper Solution

Electroless Copper Solution - CAS N/A - Chemical Product
Hazardous Product
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Overview

Electroless Copper Solution for reliable PTH and circuit board plating.

CAS Number

N/A

Molecular Formula

N/A

Product Grade

SEMI

Danger Class

CLASS 8

Corrosive Substances

Appearance

liquid

Delivery Forms

Drum IBC Bulk

Product Description

Electroless Copper Solution is a specialized chemical used in the electronics industry for depositing a uniform layer of copper on surfaces without the use of electrical current. It is widely applied in the fabrication of printed circuit boards (PCBs) and through-hole plating (PTH). This solution is essential for enhancing conductivity and adhesion between different layers in electronic components. Notable for its ability to provide excellent coverage even in complex geometries, it supports the growing demands of the semiconductor and electronics sectors.